BOE Advances into Semiconductor Territory
BOE, a prominent Chinese producer of LCD and OLED screens, is gearing up to develop glass core substrates for the next wave of domestic processors, according to a report from Nikkei. The firm is set to initiate a test production line for these substrates in the latter half of 2025, positioning itself as a noteworthy player in the semiconductor field, alongside industry behemoths like Intel, Samsung, and TSMC.
An executive from a leading display and semiconductor equipment supplier shared with Nikkei, “BOE is reallocating its efforts from its display segment to concentrate more on semiconductor-related technologies.”
The Nikkei report, informed by two sources familiar with the plans, states that BOE aims to start setting up this production line later this year, although BOE has yet to confirm these details. The company’s expertise in managing rectangular panels and its status as one of the largest manufacturers of LCD and OLED panels globally will serve it well. However, the transition to semiconductor packaging, with its unique glass composition needs and exacting precision requirements, will necessitate substantial investment in research and development, new equipment, and innovative processing techniques.
The stakes are high, but the rewards could be transformative. Overcoming the technical and financial challenges could lead to significant advancements in chip assembly through panel-level packaging on high-tech glass, enhancing performance and reducing costs.
As per Nikkei Asia, BOE is actively engaging with suppliers to acquire semiconductor equipment suitable for panel-based chip packaging technologies, signaling a strategic pivot. A top executive from a major display and chip equipment maker noted that BOE is shifting focus from display technologies to semiconductors.
Another executive, from a firm specializing in semiconductor manufacturing tools, mentioned that BOE is not alone, as many display producers are looking to make their mark in the semiconductor industry. However, BOE is particularly well-positioned for success due to its substantial resources and proactive approach to technological innovation. The source highlighted BOE’s commitment to exploring novel materials like glass core substrates. Boyce Fan, a vice president at TrendForce, concurred, noting that Chinese display companies are branching into semiconductors, with BOE at the forefront due to its advanced capabilities and extensive resources. He added that significant advancements in this field require extensive technology testing and sufficient market demand.
New Challenges and Significant Opportunities
Glass substrates provide several advantages over traditional organic substrates, such as superior flatness which enhances lithography precision, and improved dimensional stability for interconnects. These features are crucial for next-generation system-in-packages (SiPs) that incorporate multiple chiplets. Intel points out that glass substrates also offer better thermal and mechanical stability, allowing for operation at higher temperatures — a plus for data center applications. Additionally, they can support an interconnect density up to ten times higher, critical for enhancing power delivery and signal routing in sophisticated SiPs.
For BOE and other display manufacturers, transitioning from producing LCD and OLED screens to semiconductor manufacturing presents its set of challenges due to the different materials involved. Companies like AMD are exploring glass substrates made from materials such as borosilicate, quartz, and fused silica, which provide notable benefits over traditional materials due to their exceptional flatness and stability. These materials could also benefit display technologies, and it’s likely that BOE and its competitors are researching them, though their readiness for mass production remains uncertain.
The U.S. government’s restrictions on China’s semiconductor industry have slowed its progress, but they also create opportunities for companies to enter the market with less competition from established Western firms. With leading chip designers and manufacturers restricted from supplying major Chinese firms, local entities like BOE have a clear path to develop advanced computing platforms. Investing in R&D for new materials and technologies, as well as retooling factories, becomes a justifiable strategy for companies aiming to capitalize on these unique market conditions.
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Avery Carter explores the latest in tech and innovation, delivering stories that make cutting-edge advancements easy to understand. Passionate about the digital age, Avery connects global trends to everyday life.